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PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC the Infrared Thermal Image Analyzer

SKU: 62098527524

Listed price
USD45.55
USD71.55

Pay in 4 interest-free payments of $11.39 Learn more

Studio score
4.5

Atelier verified · Current finish lot

Fit · Measure
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Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 8 - Sep 13

Description

the Infrared Thermal Image Analyzer can test your cell phone main board

Octoplus Pro Box

china phone SK Hynix

Fast USB 3

P8 LITE SMART

PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC the Infrared Thermal Image AnalyzerPHONEFIX Heating Station + 3 kinds Motherboard Heating groove Features : Brand: PHONEFIX Voltage: 110V 220V Demolition shield temperature adjustment 180 220 In addition to CPU side glue temperature 180 220 Demolition A8 A9 A10 A11CPU the temperature 230 240 Desmearing temperature 180 200 Reballing BGA chip temperature 180 200 Soldering A8 A9 A10 A11 CPU temperature 190 210 Optional Types : 120X MAX ( 3 IN 1 ) for iPhone X XS XS MAX Double Layers Board

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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