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Oak board · Arch frame · Studio seal

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Quickly judge the failure point

SKU: 98384691748

Listed price
USD25.89
USD72.89

Pay in 4 interest-free payments of $6.47 Learn more

Studio score
4.4

Atelier verified · Current finish lot

Fit · Measure
Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 7 - Sep 12

Description

Quickly judge the failure point of no display or camera not working through the EDP display connector

· Free ROTS Operating system

Bubble Remover For iPhone/ Samsung/Huawei/ Xiaomi/ HTC/ Motolora/ Oppo/ LG/ SONY

Maximum Voltage: 35

upgrade the system software through the USB

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Quickly judge the failure pointXZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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